Intel IXP455 Network Processor
Ideal for Communications and Embedded Networking Applications. The highly integrated, single-chip design of the Intel IXP455 network processor provides a unique combination of performance, reliability, and flexibility, and extends Intel XScale technology into a broad range of applications that require built-in communications functionality such as networking gateways, security appliances, interactive clients, test and instrumentation, RFID readers, and networked print imaging applications.
Features and Benefits
Intel XScale core available at 266, 400, and 533 MHz Delivers high MIPS/power consumption ratio and provides ample processing headroom for value-added software features
32-bit 33/66 MHz PCI v2.2-compatible, host and option interface Provides flexibility to directly connect devices including 802.11x chips, PCMCIA controllers, and cable MAC/PHYs
USB v1.1 device controller
USB v2.0 host controller, supports low-speed and full-speed modes only
Industry-standard interface for connection to a wide array of devices
32-bit, DDR1-266 SDRAM interface for 32 MByte to 1 GByte of memory High-bandwidth memory interface
32-bit expansion bus interface with parity
Master/Target capable
25-bit address
Glueless connection to other devices
External mastering capability allows external devices to communicate with each other and with internal peripherals resulting in shared memory subsystem design and lower system cost
Up to three integrated 10/100 Ethernet MACs with MII interface
Industry-standard networking interface
Multiple ports allow lower system cost, multiple LAN port support, and concatenation of networking modules
UTOPIA-2 interface with multiple ADSL/G.SHDSL or VDSL PHY support Industry-standard
WAN interface
Two High-Speed Serial (HSS) ports for connecting to T1/E1 or SLIC/CODEC Connects to T1/E1 or SLIC/CODEC for voice support
Silicon functional assistance for Random Number Generation Accelerates public key exchange, authentication and key generation
Integrated hardware support for popular cryptography algorithms Acceleration for popular applications such as IPSec and SSL VPNs (AES/ AES-CCM/ 3DES/ DES /SHA-1 /SHA-256 /SHA-384 /SHA-512 /MD-5 /RSA /DSA /Diffie-Hellman algorithms)
Two high-speed UARTs support up to 921 Kbaud each Provides an interface for debug and passing control information
Integrated I2C and SSP interfaces Provides serial interface for common embedded and communications application; reduces system BOM
Spread-spectrum clocking Improves system reliability by reducing EMI
Comprehensive pre-validated, pre-integrated "out-of-the-box" development infrastructures ready for application development using Linux* and VxWorks* Ease of design and fast time-to-market
544-ball PBGA package
35 mm x 35 mm, 1.27 mm ball pitch
Lead-free packages available
Commercial temperature
(0° to 70° C)
Extended temperature
(–40° to 85° C)
High-performance package provides improved reliability
Lead-free packages help meet environmental regulations
Extended temperature support for industrial control and automation applications
Saturday, January 23, 2010
AMD's new mobile processor is called Turion Ultra
AMD's new mobile processor is called Turion Ultra
Mountain House (CA) - Computex Taipei 2008 is just around the corner and news of what we can expect to see at the conference is already trickling in. Nvidia will release its new GeForce GTX 280 and 260 GPUs, AMD its Radeon 4850 and 4870 as well as its Puma notebook platform.
According to our sources at a top-tier OEM/ODM, AMD will be announcing Puma as well as the Griffin processor on June 3 (local time), the first day of the show. Puma will consist of the Griffin CPU, which we now know will be called “Turion Ultra”, a mobile version of the 780G chipset (RS780M), the Mobility Radeon 3200 graphics chip (integrated in the mobile 780G chipset) as well as Wi-Fi chips from the usual suspects (Atheros, Broadcom, Marvell, Ralink).
Puma will show up in all major notebook form factors (12.1”, 13.3”, 15.4” and 17") and will be on display with ATI Mobility Radeon 3450, 3650 and 3850 discrete graphics chips. SSDs will be available as an option, albeit in a very limited fashion: Puma will aim for the volume business and consumer markets and SSD simply are still “too expensive” for these segments. That scenario should change with the arrival of AMD’s 2009 Shrike mobile platform (better known for its Fusion processor), which is expected to see a greater adoption of SSD devices.
At this time, we have no information whether Puma and its Turion Ultra will be available in volume from day one. Stay tuned for more information coming soon.
Despite the fact that a first Intel Montevina notebook has been announced already, don’t expect the platform to debut at Computex. Montevina notebooks are likely to have a significant presence at the show, but our sources indicated that the platform will not be launched until later in the month.
Mountain House (CA) - Computex Taipei 2008 is just around the corner and news of what we can expect to see at the conference is already trickling in. Nvidia will release its new GeForce GTX 280 and 260 GPUs, AMD its Radeon 4850 and 4870 as well as its Puma notebook platform.
According to our sources at a top-tier OEM/ODM, AMD will be announcing Puma as well as the Griffin processor on June 3 (local time), the first day of the show. Puma will consist of the Griffin CPU, which we now know will be called “Turion Ultra”, a mobile version of the 780G chipset (RS780M), the Mobility Radeon 3200 graphics chip (integrated in the mobile 780G chipset) as well as Wi-Fi chips from the usual suspects (Atheros, Broadcom, Marvell, Ralink).
Puma will show up in all major notebook form factors (12.1”, 13.3”, 15.4” and 17") and will be on display with ATI Mobility Radeon 3450, 3650 and 3850 discrete graphics chips. SSDs will be available as an option, albeit in a very limited fashion: Puma will aim for the volume business and consumer markets and SSD simply are still “too expensive” for these segments. That scenario should change with the arrival of AMD’s 2009 Shrike mobile platform (better known for its Fusion processor), which is expected to see a greater adoption of SSD devices.
At this time, we have no information whether Puma and its Turion Ultra will be available in volume from day one. Stay tuned for more information coming soon.
Despite the fact that a first Intel Montevina notebook has been announced already, don’t expect the platform to debut at Computex. Montevina notebooks are likely to have a significant presence at the show, but our sources indicated that the platform will not be launched until later in the month.
Intel demos first-ever 32nm processors
Intel demos first-ever 32nm processors
Intel had a little roadmap event today to shed some light on its massive $7b fab investment, and the focus was mostly on the upcoming transition to 32nm processors -- highlighted by the first-ever demo of a working 32nm Nehalem-based Westmere chip. It was just a demo, so there aren't any hard benchmarks available, but eventually the tech will show up in the Calpella platform's dual-core Clarkdale laptop processors that integrate two processor cores, a graphics core, and a memory controller all in a chip the size of one 45nm quad-core Clarksfield chip. (Yes, the codenames are confusing as hell.) Intel wouldn't lock down the schedule for any of this stuff, but when we asked them about the rumored Calpella delays we heard about this morning we were told that parts of the platform will definitely go into production sometime in 2009. Video, slides, and the full press release after the break.
Intel had a little roadmap event today to shed some light on its massive $7b fab investment, and the focus was mostly on the upcoming transition to 32nm processors -- highlighted by the first-ever demo of a working 32nm Nehalem-based Westmere chip. It was just a demo, so there aren't any hard benchmarks available, but eventually the tech will show up in the Calpella platform's dual-core Clarkdale laptop processors that integrate two processor cores, a graphics core, and a memory controller all in a chip the size of one 45nm quad-core Clarksfield chip. (Yes, the codenames are confusing as hell.) Intel wouldn't lock down the schedule for any of this stuff, but when we asked them about the rumored Calpella delays we heard about this morning we were told that parts of the platform will definitely go into production sometime in 2009. Video, slides, and the full press release after the break.
Why Does the Intel Xeon Processor 5500 Series Support a Third Memory Channel?
Why Does the Intel Xeon Processor 5500 Series Support a Third Memory Channel?
Looks like the Intel Xeon processor 5500 series is making lots of noise in HPC. The QPI and integrated memory controller are really providing the boost necessary to make it an all around performance leader for HPC applications. With all this performance why did Intel add a third memory channel?
The third memory channel enables the platform to support a boat load of memory. Matter-of-fact, up to 192GB can be supported in a two socket configuration. It wasn’t too long ago when only 32GB was supported in a dual socket configuration. By having the ability to support so much memory you can now meet the needs of almost every HPC application. The 5500 series is intended for all server markets, but let’s face it, with the design changes Intel made with the new architecture the server segment gaining the most benefit appears to be HPC.
It seemed like yesterday when the only way to have access to large memory configurations was through expensive, proprietary SMP systems. The HPC market for large SMP systems is still out there but it is shrinking…fast. Today, we are clustering low cost solutions to create some of the most powerful systems in the world. Standard components are leading to lower and lower system costs, delivering a price/performance advantage alternative solutions cannot meet.
Now that a single dual socket node can support up to 192GB’s it is important to understand how to get there. First, to enable 192GB you need 16GB DIMMs x 12 memory slots. There will be a premium for a 16GB DIMM. Knowing the options and determining the best, most cost effective solution is going to be dependent upon your environment. When a large memory node is required, do you purchase the 16GB DIMM’s or go up to a Multi-socket solution? If I decide to scale back on the memory (use 4GB or 8GB DIMMs instead of 16GB DIMMs) what is the performance impact to my application? If I am cost sensitive, will the lower cost outweigh the lack of performance? Can I use SSD’s (Solid State Disk drives) to compensate for any performance loss due to lower memory capacity? There are many questions to think about when deciding the right configuration for your application and environment and I certainly can’t answer them here.
Let’s not forget the third memory channel enables a different set of optimal memory configurations. Think x3 when deciding on how much memory to install into your node; 12GB, 24GB, 48GB, etc. What happens when you don’t use an optimal configuration? Well it depends, in most cases the impact is minimal, but let me add a bit of context around minimal:
· Low bandwidth sensitivity (more dependent upon the processor for performance)
– E.g. Monte Carlo, Black-Scholes (financial modeling), BLAST (bioinformatics), AMBER (molecular dynamics)
– Expect less than a 2% difference between memory configurations*
Medium bandwidth sensitivity (somewhat balanced between memory and CPU usage)
– E.g. CFD, Explicit FEA, Implicit FEA (with robust I/O system)
– Expect approx. 5% degradation for non-optimal symmetrical configurations*
High bandwidth sensitivity (high access to the system memory)
– E.g. WRF (weather), POP (climate), MILC (physics), Reservoir Simulation
Expect approx. 10% degradation for non-optimal symmetrical configurations*
The results are interesting. In all three cases above, the degraded performance is always better than the performance you would have with only two memory channels.
When you hear about performance impact of non-optimal memory you can see by the examples above, it is application dependent and will not have a severe impact on your overall system performance.
The Intel Xeon processor 5500 series offers support for huge memory nodes with the addition of the third memory channel. Memory configurations in multiples of three are ideal, but if you decide to stay with a power of two configuration the performance should still exceed that of a solution based upon only two memory channels.
Looks like the Intel Xeon processor 5500 series is making lots of noise in HPC. The QPI and integrated memory controller are really providing the boost necessary to make it an all around performance leader for HPC applications. With all this performance why did Intel add a third memory channel?
The third memory channel enables the platform to support a boat load of memory. Matter-of-fact, up to 192GB can be supported in a two socket configuration. It wasn’t too long ago when only 32GB was supported in a dual socket configuration. By having the ability to support so much memory you can now meet the needs of almost every HPC application. The 5500 series is intended for all server markets, but let’s face it, with the design changes Intel made with the new architecture the server segment gaining the most benefit appears to be HPC.
It seemed like yesterday when the only way to have access to large memory configurations was through expensive, proprietary SMP systems. The HPC market for large SMP systems is still out there but it is shrinking…fast. Today, we are clustering low cost solutions to create some of the most powerful systems in the world. Standard components are leading to lower and lower system costs, delivering a price/performance advantage alternative solutions cannot meet.
Now that a single dual socket node can support up to 192GB’s it is important to understand how to get there. First, to enable 192GB you need 16GB DIMMs x 12 memory slots. There will be a premium for a 16GB DIMM. Knowing the options and determining the best, most cost effective solution is going to be dependent upon your environment. When a large memory node is required, do you purchase the 16GB DIMM’s or go up to a Multi-socket solution? If I decide to scale back on the memory (use 4GB or 8GB DIMMs instead of 16GB DIMMs) what is the performance impact to my application? If I am cost sensitive, will the lower cost outweigh the lack of performance? Can I use SSD’s (Solid State Disk drives) to compensate for any performance loss due to lower memory capacity? There are many questions to think about when deciding the right configuration for your application and environment and I certainly can’t answer them here.
Let’s not forget the third memory channel enables a different set of optimal memory configurations. Think x3 when deciding on how much memory to install into your node; 12GB, 24GB, 48GB, etc. What happens when you don’t use an optimal configuration? Well it depends, in most cases the impact is minimal, but let me add a bit of context around minimal:
· Low bandwidth sensitivity (more dependent upon the processor for performance)
– E.g. Monte Carlo, Black-Scholes (financial modeling), BLAST (bioinformatics), AMBER (molecular dynamics)
– Expect less than a 2% difference between memory configurations*
Medium bandwidth sensitivity (somewhat balanced between memory and CPU usage)
– E.g. CFD, Explicit FEA, Implicit FEA (with robust I/O system)
– Expect approx. 5% degradation for non-optimal symmetrical configurations*
High bandwidth sensitivity (high access to the system memory)
– E.g. WRF (weather), POP (climate), MILC (physics), Reservoir Simulation
Expect approx. 10% degradation for non-optimal symmetrical configurations*
The results are interesting. In all three cases above, the degraded performance is always better than the performance you would have with only two memory channels.
When you hear about performance impact of non-optimal memory you can see by the examples above, it is application dependent and will not have a severe impact on your overall system performance.
The Intel Xeon processor 5500 series offers support for huge memory nodes with the addition of the third memory channel. Memory configurations in multiples of three are ideal, but if you decide to stay with a power of two configuration the performance should still exceed that of a solution based upon only two memory channels.
Intel P55 motherboard
Although not yet officially introduced, but in the event the Computex 2009, Intel P55 motherboard is also one of the interesting attention. Motherboard with processor socket LGA 1156, is aimed at Lynnfield processor or with a password which is also known as the Core i5 will introduced by Intel.
Motherboard with Intel P55 chipset this will also be equipped with a SATA interface support 600, to transfer data faster with the media is now faster, such as solid stat drive (SSD). Motherboard with Intel P55 chipset will also be have support for SLI configurations.
Some motherboard manufacturers are already showing prototype motherboards with this chipset. Among them are also using the chipset that is equipped with technology Brainwood. Brainwood allows the motherboard is supplied with an expansion card slot, shaped like a slot for RAM, for storage media-based flash memory and functions as a hard disk buffer, which is planned to be called Intel Turbo memory 2.
Motherboard with Intel P55 chipset this will also be equipped with a SATA interface support 600, to transfer data faster with the media is now faster, such as solid stat drive (SSD). Motherboard with Intel P55 chipset will also be have support for SLI configurations.
Some motherboard manufacturers are already showing prototype motherboards with this chipset. Among them are also using the chipset that is equipped with technology Brainwood. Brainwood allows the motherboard is supplied with an expansion card slot, shaped like a slot for RAM, for storage media-based flash memory and functions as a hard disk buffer, which is planned to be called Intel Turbo memory 2.
Intel Computadoras Comentarios - D945GCLF Motherboard CPU Bundle
The motherboard has built-in Intel Atom 230 processor. Intel Desktop D945GCLF - Internet-centric computing to support flexible mini - ITX form factor, I can not believe the opportunity is designed to provide. The board for users of energy - the home-effective solution, as well as the needs of a unique vertical market, theIntel 945GC Express Chipset and the Intel Atom processor to the 45nm process integration features. 45nm Hi - K and metal gate processor, a chance to hear about a lot of board design, the clock, the game was, and an Internet connection can learn through
Intel Unveils the Intel Atom CE4100 processor – System-on-Chip for Internet TV
Intel Unveils the Intel Atom CE4100 processor – System-on-Chip for Internet TV
The CE4100 processor, formerly codenamed “Sodaville,” is the first 45nm-manufactured consumer electronics (CE) SoC based on Intel architecture. It supports Internet and broadcast applications on one chip, and has the processing power and audio/video components necessary to run rich media applications such as 3-D graphics.
Intel Unveils 45nm System-on-Chip
As TVs become more interactive, Adobe Flash is an important enabling technology to help content developers blend together video, 3-D animation and rich graphics. Intel is working with Adobe to port Adobe Flash Player 10 to the family of Intel CE media processors to optimize the playback of graphics and H.264 video to enable for the first time a wide array of Flash-based content on the television.
On-Demand Gaming for TV
TransGaming President and CEO Vikas Gupta announced an on-demand gaming service called GameTree.tv* to be optimized for connecteddigital TVs and CE devices powered by Intel media processors.
The GameTree.tv service will offer a broad library of games such as sports, action and adventure and provide content developers with a software development kit to support the migration of existing games and the development of new games based on the Intel CE platform. It will help revolutionize the delivery and global consumption of video games and provide a turnkey monetization strategy for CE manufacturers and cable/satellite providers (MSOs).
TV Widgets, Interactive TV Applications
Intel CE media processors provide a full-featured software framework called Widget Channel for the development of Internet applications, or TV widgets. Broadcast networks such as CBS are expanding the gallery of TV widgets to help their viewers find and connect to premium content in a more personalized manner.
Intel is working with the industry to expand Widget Channel to provide consumers a range of services such as movies, music, games and personal videos. TV Widgets and services shown at IDF were from Accedo Broadband*, The Associated Press*, BIGSTAR.tv*, CBS*, CinemaNow*, Dailymotion*, Immediatek*, Mediafly, MyVideo*, Netflix*, PlayJam*, RadioTime*, RallyPoint*, ShowTime Networks*, Tagesschau* and WhereverTV.*
Intel Atom Processor CE4100
The CE4100 processor can deliver speeds up to 1.2GHz while offering lower power and a small footprint to help decrease system costs. It is backward compatible with the Intel MediaProcessor CE 3100 and features Intel Precision View Technology, a display processing engine to support high-definition picture quality and Intel Media Play Technology for seamless audio and video. It also supports hardware decode of up to two 1080p video streams and advanced 3-D graphics and audio standards. To provide OEMs flexibility in their product offerings, new features were added such as hardware decode for MPEG4 video that is ready for DivX Home Theater 3.0 certification, an integrated NAND flash controller, support for both DDR2 and DDR3 memory and 512K L2 cache. The CE SoC contains a displayprocessor, graphics processor, video display controller, transport processor, a dedicated security processor and general I/O including SATA-300 and USB 2.0.
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